OPTION |
CODES |
Face Options
4th digit of part number, default is "1"
- Metallized faces allow for tight height tolerances down to ±0.0003 inches. This is especially important when your application uses 2 or more TEC's in an assembly.
- Mettalized faces also allow for solder mounting which is a superior heat transfer path compared to thermal greases and epoxies.
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0 = Metallized, top and bottom faces
1 = Lapped, top and bottom faces
2 = Metallized top, lapped bottom
3 = Lapped top, metallized bottom
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Wire Type
7th digit of part number, default is "L" |
B = 28 AWG Bus wire
C = 26 AWG Bus wire
D = 20 AWG Bus wire
E = 16 AWG Bus wire
F = 30 AWG Bus wire w/ Teflon insulation
G = 26 AWG Bus Wire w/ Teflon insulation
H = 20 AWG Bus Wire w/ Teflon insulation
J = 30 AWG stranded Wire w/ Teflon insulation
K = 26 AWG stranded Wire w/ Teflon insulation
L = 20 AWG stranded Wire w/ Teflon insulation
M = 16 AWG stranded Wire w/ Teflon insulation
Call for custom wire types and lengths |
Height Tolerance
8th digit of part number, default is "2"
- Specify code 7, 4, or 5 when using 2 or more TEC's in a single assembly to assure even pressure and heat transfer. Call for more information.
- Choose a height tolerance that suits your application
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0 = Unmachined/unlapped
1 = ±0.010
2 = ±0.007
3 = ±0.005
4 = ±0.0005
5 = ±0.0003
6 = ±0.002
7 = ±0.001
All tolerances in inches. |
Sectioning (bottom plate only)
Add codes to end of part number
- Sectioning of TEC's greater than 1" in cycling and extreme duty applications reduces thermal stresses and extends TEC life. Call for more information.
- See examples, click here.
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C1 = Bottom plate sectioned into 4 pads
C2 = Bottom plate sectioned into 9 pads
C3 = Bottom plate sectioned into 16 pads
C4 = Bottom plate sectioned into 25 pads
C5 = Bottom plate sectioned into 36 pads
C6 = Bottom plate sectioned into 49 pads
C7 = Bottom plate sectioned into 64 pads |
Other Options
Add codes to end of part number |
E1 = Mil spec testing and Burn-in
E2 = Custom Burn-in
R = Modified for high G forces
G1 = Top and bottom plates are gold (Au) plated (for fluxless soldering)
G2 = Top plate is gold (Au) plated
G3 = Bottom plate is gold (Au) plated
P = Polarity of wire leads is reversed
S = Sealed for moisture protection
T1 = Tinned on bottom w/ 183°C 63/37 solder
T2 = Tinned on top w/ 183°C 63/37 solder
T3 = Tinned on top & bottom w/ 183°C 63/37 solder
More than one option code may be specified at one time.
Additional options (please call ):
• Holes
• Installed Thermocouples
• Gold, silver, nickel, or tin plating
(metallized TEC’s only)
• Wide temperature range of pre-tinned solder options
• Shock and vibration screening
• Thermal uniformity matching
• ∆T Matching (for multi TEC sets)
• AC resistance matching to 5 milliohms
(for multi TEC sets)
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